Student Paper Travel Assistance/Scholarship Winners

It is a great honor to announce the Awardees of the IES-SYPA competition for the IEEE INDIN 2019. Important note for the S&YP that applied for the IES-SYPA: In this year for the IEEE INDIN'19 we have received 12 applications for the IEEE IES STUDENT & YOUNG PROFESSIONALS PAPER ASSISTANCE (IES-SYPA). The average weighted score is 6.88. We would like to announce 5 IES-SYPA (recognition diploma plus up-to USD 2000 travel costs reimbursement) recipients (see the table below). Congratulations to all the winners.

Winners

Name
Affiliation
Paper Title
Dr. Zheng Jun Chew University of Exeter, United Kingdom Energy Harvesting Powered Wireless Sensor Nodes With Energy Efficient Network Joining Strategies
Ms. Lehlogonolo P.I. Ledwaba City University of Hong Kong, Hong Kong Developing a Secure, Smart Microgrid Energy Market using Distributed Ledger Technologies
Mrs. Yulia Berezovskaya Luleå University of Technology, Sweden A hybrid fault detection and diagnosis method in server rooms’ cooling systems
Mr. Md. Ibrahim Mamun University of Asia Pacific, Bangladesh AutiLife: A Healthcare Monitoring System for Autism Center in 5G Cellular Network using Machine Learning Approach
Dr. Haibo Cheng Shenyang Institute of Automation, Chinese Academy of Sciences, China ANN based Interwell Connectivity Analysis in Cyber-Physical Petroleum Systems

Student Paper Travel Assistance/Scholarship Program

The IEEE Industrial Electronics Society is encouraging students and young professional authors to apply for the IES-SYPA travel assistance/Scholarships. Please follow the guidelines in the document here.

Note: The application deadline is over and winners announced